Ceramic PCBs are no more an exotic substrate and are now very accessible to PCB designers. Advances in recent production techniques such as Direct Plated Copper (DPC) and Advanced Metal Brazing (AMB) have made ceramics a much more viable choice. With the miniaturisation DPC offers for microelectronics and the need for substrates capable of withstanding high operating temperatures to 800°C whilst offering outstanding thermal conductivity (up to 180W/mK) makes these substrates more popular than ever.
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