High-Density Interconnect PCBs (HDI PCBs)

High-Density Interconnect PCBs (HDI PCBs) offer a superior wiring density compared to traditional through-hole designs, enabling advanced and compact electronic solutions. Defined under IPC-6012 standards, these PCBs feature an average of 20 or more electrical connections per square centimetre on each side, making them ideal for sophisticated, space-efficient applications.

HDI technology supports the development of smaller, lighter, and highly reliable electronic devices by incorporating multiple layers, precise tracks, microvias, and blind or buried vias. With HDI, shorter signal paths minimise power loss and improve overall electrical performance. This enhanced performance makes HDI PCBs indispensable for high-speed signals and applications requiring robust signal integrity in cutting-edge technologies.

Key Features of HDI PCBs

HDI PCB designs follow IPC-2226 guidelines, which specify key features that contribute to their advanced functionality:

• Blind and Buried Vias: Specialised vias that connect select PCB layers without passing through the entire board, optimising space usage and enhancing design flexibility.
• Fine Line Widths and Spacing: Tracks and gaps narrower than 100µm facilitate increased component density.
• Microvias: Compact laser-drilled vias, typically smaller than 150 µm in diameter, ensure efficient interconnections between PCB layers.
• Multi-Layered Structures: Staggered, stacked, or sequentially laminated layers maximise the PCB's ability to house complex circuits.

HDI Capabilities

HDI Sample

• 3 sequential lamination cycles
• 5 buried via drill stages, 2 blind via drill stages, 1 plated through drill stage
• 100um track and gap internal layers
• 125um track and 100um gap external layers
• Copper filled blind vias
• Enig finish
• High Tg FR4